Top ten semiconductor technologies that are most p

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The top ten semiconductor technologies worth looking forward to in 2008 (Part 2)

in the history of the development of semiconductor technology, 2008 is the most brilliant year. 60 years ago, the first transistor was born in Bell Laboratories. Since then, mankind has entered the electronic era of rapid development. Fifty years ago, the first integrated circuit was born in TI company. From then on, we entered the era of microelectronics. 40 years ago, neus, Moore and grove, among the "8 rebels" of Fairchild company, founded Intel company. This idea was unanimously recognized by designers and engineers at an industry conference held this month. Orck, another employee of Fairchild company, founded AMD, Their entrepreneurship has triggered a high-tech entrepreneurship boom sweeping the world since Silicon Valley! Thirty years ago (February 16, 1978), wardchristiansen and randyseuss in Chicago developed the first computer bulletin board system, which became the star of the popularization of the Internet. Since then, mankind has entered the Internet era 2008 is also the year that carries the most dreams of Chinese people, including 3G, Olympics, mobile video, GPS, HD TV, TPMS, RFID Countless high-tech dreams will be realized in 2008. "A year's plan lies in spring" at the beginning of 2008, let's inspire words and jointly look forward to the top ten semiconductor technologies in 2008

VI. ultra low power consumption Bluetooth

attention index: ★★★

after more than 10 years of development, Bluetooth has finally ushered in a harvest period in the past two years. However, the power consumption and speed of Bluetooth are the weaknesses affecting its application. With the rise of the sports and health care market, Bluetooth Technology needs lower power consumption and higher transmission rate. In mid June 2007, the Bluetooth technology alliance and Nokia jointly announced that, Wibree forum, an organization dedicated to promoting the extremely low-power wireless technology wibree developed by Nokia, is incorporated into the Bluetooth technology alliance. W is mainly used to do the pull-out experiment of steel hammer. Ibree will become a part of the Bluetooth specification as an ultra-low-power Bluetooth technology. Bluetooth SIG (bluetoothspeicaleinterestsgroup) said that the ultra-low power ULP (ultralowpower) Bluetooth standard and high-speed Bluetooth standard will be officially introduced in early 2008. Some semiconductor companies, such as Nordic, have announced that they will launch ULP Bluetooth chips in the first quarter of 2008. It can be expected that 2008 will be a year when ultra-low power consumption will flourish. In addition, the high-speed Bluetooth specification (bluetooth3.0) integrated with UWB technology is expected to promote the development of high-speed Bluetooth by the end of 2008. The high-speed version of Bluetooth will still use UWB technology, with a maximum speed of 480mbps


attention index: ★★ ★

RFID technology did not usher in the expected blowout application in 2007. The reason is that the high cost of chips and the immature market are the main factors. In 2008, with the increase in people's demand for food safety and the convening of the Olympic Games, RFID will finally start to become popular. First, semiconductor manufacturers led by NXP and Ti began to promote RFID solutions, and second, in terminal applications, Wal Mart, the world's largest retail giant, will set up a factory in Dongguan to produce cartons with RFID chips, which shows that RFID has finally entered a substantial stage of development in the retail industry. The RFID reader chip launched by Samsung and other companies will help to enable people to have the function of reading RFID information, which will be conducive to the popularization of RFID applications. It can be predicted that RFID technology will open a huge emerging semiconductor market from 2008

VIII. MEMS technology

attention index: ★★

micro electro mechanical system (MEMS) for the purpose of processing micro/nano structures and systems is the miniaturization revolution of microelectronic technology. Its manufacturing processes include: lithography, etching, deposition, epitaxial growth, diffusion, ion implantation, testing, monitoring and packaging. MEMS organically connects the electronic system with the external world. It can not only feel natural signals such as motion, light, sound, heat, magnetism, etc., and convert these signals into electrical signals that the electronic system can recognize, but also control these signals through the electronic system, and then send instructions to control the execution parts to complete the required operations. MEMS was once highly expected by the industry, but due to the drag of semiconductor technology, the development of MEMS technology did not achieve the expected popularity. However, we noticed that in 2007, MEMS devices have been gradually commercialized. Fujitsu has been selling three-axis MEMS accelerometers integrated with ADI, and Nokia has also launched a shell with flash function, which can "spray" information in the air, And play action games by tilting and moving. Fujitsu's lifebookq2010 laptop uses aku2000 MEMS on-chip microphone from akustica. Freescale has launched a TPMS scheme based on MEMS technology. In 2007, micro sensor technology has also made great progress. With the development of microprocessor technology and semiconductor technology, we have reason to believe that in 2008, the application boom of MEMS technology is about to begin

IX. verification technology in SoC design

attention index: ★★

after low-power design, verification technology in SoC design has become a technical hotspot of many EDA giants. Because with the wide measurement range of Vickers hardness test on SOC, the number of body tubes is increasing, and more and more functions need to be verified. The real-time pressure from the market also urges designers to find a way to perform the required verification, because the implementation of verification accounts for almost two-thirds of the whole chip design work. In fact, verification has become another difficult problem after the relay power consumption problem of IC design. It has also become a key factor in accelerating the release of chips! In 2007, EDA industry giants Synopsys, cadence, mentor and others successively launched tools to improve verification efficiency. It is expected that this problem will be substantially improved in 2008

X. reconfigurable technology

attention index: ★

the reconfigurationofcircuitryatruntime technology, which was born in the 1950s and 1960s, was not gradually formed and became a research hotspot until the mid-1990s due to the limitations of hardware and many other aspects. At present, with the increasing improvement of the functions of semiconductor devices, especially the rapid development of programmable devices, this almost delusional technology has been commercially available. In 2007, the defense advanced technology research program (DARPA) launched the "multimodal computing architecture (PCA)" project, which is part of the military's autonomous weapons and equipment program. Its core is to adopt the "reconfigurable computing structure". At present, reconfigurable technology mainly focuses on the application of automotive electronics, information technology and high-performance robots. In the future, with the improvement of semiconductor device performance and the reduction of price, This advanced technology will also enter other fields such as consumer electronics

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